S25FL256SAGNFI010 256Mb (32MB) Serial NOR Flash 104MHz SPI 100K Erase/Program Cycles 20-Year Data Retention 2.7-3.6V WSON-8 -40°C to +85°C Automotive

S25FL256SAGNFI010

Features

• CMOS 3.0V core with versatile I/O

• Serial Peripheral Interface (SPI) with multi-I/O- SPI clock polarity and phase modes 0 and 3- DDR option- Extended addressing: 24- or 32-bit address options- Serial command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families- Multi I/O command set and footprint compatible with S25FL-P SPI family

•Read commands- Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR- AutoBoot – Power up or reset and execute a Normal or Quad read command automatically at a preselected address- Common Flash Interface (CFI) data for configuration information

• Programming (1.5 MBps)- 256- or 512-byte page programming buffer options- Quad-input page programming (QPP) for slow clock systems- Automatic ECC-internal hardware error correction code generation with single-bit error correction

• Erase (0.5 to 0.65 MBps)- Hybrid sector size option – Physical set of thirty two 4-KB sectors at top or bottom of address space with all remaining sectors of 64 KB, for compatibility with prior generation S25FL devices- Uniform sector option – always erase 256-KB blocks for software compatibility with higher density and future devices

•Cycling endurance- 100,000 program-erase cycles, minimum

•Data retention- 20 year data retention, minimum

• Security features- One-time programmable (OTP) array of 1024 bytes-Block protection

• Status Register bits to control protection against program or erase of a contiguous range of sectors

• Hardware and software control options- Advanced sector protection (ASP)

• Individual sector protection controlled by boot code or password

• 65-nm MIRRORBIT™ technology with Eclipse architecture

• Core supply voltage: 2.7 V to 3.6 V

• I/O supply voltage: 1.65 V to 3.6 V - SO16 and FBGA packages

Temperature range/grade:

- Industrial (40°C to +85°C)

- Industrial Plus (40°C to +105°C)

- Automotive AEC-Q100 grade 3 (40°C to +85°C)

- Automotive AEC-Q100 grade 2 (40°C to +105°C)

- Automotive AEC-Q100 grade 1 (40°C to +125°C)

Packages (all Pb-free)

- 16-lead SOIC (10.30 × 7.50 × 2.65 mm) (300 mil)

- 8-lead DFN (6.0 × 8.0 × 0.8 mm) (WSON)

- 24-ball FBGA (8.0 × 6.0 × 1.2 mm)

• 5 × 5 ball (FAB024) and 4 × 6 ball (FAC024) footprint options

• Known good die (KGD) and known tested die

Information

Drawing

Our advantage :

• High quality products --- our offers are 100% new and original, ROHS
• Competitive price --- good Purchase channels with good price.
• Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
• Adequate inventory --- With the support of our strong Purchasing team,
• Fast delivery --- we will ship the goods within 1-3 working days after the payment confirmed.

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Product List
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Microchip, MAX, AD, TI, ATMEL, ST, ON, NS, Intersil, Winbond, Vishay, ISSI, Infineon, NEC, FAIRCHILD, OMRON,YAGEO, TDK, etc

S25FL256SAGNFI010 256Mb (32MB) Serial NOR Flash 104MHz SPI 100K Erase/Program Cycles 20-Year Data Retention 2.7-3.6V WSON-8 -40°C to +85°C Automotive Images